Intel Vs. Amd Cpu Manufacturing Process: 14nm Vs. 7nm Technology. – Intel has expanded its roadmap significantly since Pat Gelsinger became CEO a year ago. The chip maker plans to regain leadership in this process with a new node every four quarters. TSMC, meanwhile, has delayed mass production of its 2nm node (N2) until late 2025, giving rival foundries a chance to catch up. With almost all chip makers including Apple, AMD, MediaTek and Qualcomm relying on the Taiwanese manufacturing company to supply their chips, this means the entire industry (and its roadmap) will be affected.

In the PC processor market, this brings us to the endless competition between Intel and AMD. The latter is currently ahead of the curve across the entire portfolio using TSMC’s 7nm (and 6nm) nodes. On the other hand, Intel recently switched to its 10nm Enhanced Superfin process (called Intel 7) with the 12th generation lineup.

Intel Vs. Amd Cpu Manufacturing Process: 14nm Vs. 7nm Technology.

AMD plans to release its Ryzen 7000 processors later this year based on the Zen 4 core architecture. Like the Radeon RX 7000 GPUs, they will be manufactured on TSMC’s 5nm N5 process node, giving the chipmaker without manufacturing capacity a one-to-two technological advantage years

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Intel’s 13th generation Raptor Lake processors will stick to the 7nm node later this year. Essentially an update to Alder Lake, they will focus on multi-threaded desktop performance and on-chip bandwidth. They may be slower than AMD’s Ryzen 7000 offerings in gaming workloads, but will likely come out on top in intensive workloads like content creation.

The 14th generation Meteor Lake processors are Intel’s first major MCM or tile architecture. They are limited in displacement (laptop) space and use a 4nm node with EUV lithography. This is the first major family to use an external node (TSMC N3) for the iGPU chiplet. The performance and efficiency cores will be updated at Redmont Cove and Crestmont, respectively.

Arrow Lake will be the desktop part of the 14th generation Core family. It will be manufactured on a 20A (2nm) node (N3 node for iGPUs), which will provide a 15% PPA improvement in the DIY space, along with IPC and other architectural improvements. This is Intel’s first lineup to use GAA (Gate All Around) technology, which the chipmaker calls RibbonFET with PowerVia.

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The 15th generation Lunar Lake processors remain a mystery. Little is known about these microprocessors, other than the fact that they will be based on Intel’s 18A (1.8nm) node. They will land sometime in 2025 and compete with AMD’s Zen 5 and 6 products.

After the 5nm Zen 4 family, AMD’s pace will slow down. TSMC’s 3nm node will begin mass production in 2023, and some Apple chips will use the technology launched in the second to third quarters. Ryzen 8000/9000 processors based on 3-nanometer technology will appear sometime in 2024. They will be called Strix Point and Granite Ridge. They are rumored to use a hybrid core architecture with Zen 5 (3nm) and Zen 4c (5nm) cores. This is the point where Intel will be ahead of AMD, at least in terms of process technology. However, this does not mean that its chips will be faster or better.

From there, things have been increasingly stagnant for TSMC and its customers (read: AMD). Mass production of the N2 node is scheduled for 2025, with launch planned for early 2026. Intel, on the other hand, plans to mass produce its 18A (1.8A) chips in the second half of 2024.

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Computer equipment enthusiast, gamer and practical engineer. Former co-founder of Techquila (2017-2019), a relatively successful tech store. Since 2019, he has worked for Hardware Times, a department dedicated to computer hardware and its applications. Intel to build new 8th Gen processors with AMD Radeon Graphics with HBM2 with EMIB By Ian Cutress Nov 06, 2017 9:43 am EST

Now we have an out-of-left-field ad. Intel Corporation has officially announced that it is working on a new series of processors that combine high-performance x86 cores with AMD Radeon Graphics in a single processor using Intel’s proprietary EMIB multi-chip technology. If that wasn’t enough, Intel also announced that it has integrated the design of its latest high-bandwidth memory, HBM2.

In the last twelve months, Intel has announced EMIB technology, the main theme of which is the ability to put several different silicon dies in a single package with much higher bandwidth than a standard package, but at a much lower cost than using a silicon interposer. At Intel Manufacturing Day earlier this year, they even released a slide (above) showing what’s possible: a CPU package with x86 cores built on one technology, graphics built on another, possibly other IO and memory, or wireless technology With EMIB, processor design becomes a big Lego game.

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EMIB enters the market with the latest Intel Altera FPGA processors. By embedding the silicon design required for the EMIB into the main FPGA and each of the chipsets, the goal is to add more memory blocks as well as data communication blocks in a single mix-and-match scenario, allowing large customers to have designs tailored to their needs . . . The advantages of EMIB are clear, without the disadvantages of standard MCP design or the cost of interposers: it also allows for a design that exceeds the monolithic grid limitations of standard lithography processes. It’s always expected that EMIB should find its way into the general processor market as we start to see high-end server offerings approaching 900mm2 on multiple silicon dies in a single package.

After the announcement of EMIB, Intel’s Manufacturing Day and Hot Chips, word spread about how Intel approaches this from a consumer perspective. In accordance with the requirements of Intel’s own integrated graphics solutions, a cross-licensing agreement with NVIDIA was concluded in 2011 – this agreement expires on April 1

2017, and no mention of an extension of this agreement has been made public. Rumor has it that Intel is going to make a deal with AMD because, despite the x86 rivalry, they are the better partner in these matters. Many AMD and Intel related outlets are unable to provide any information. Intel has previously declined to comment on such matters in advance. Other potential leaks include published SiSoft benchmarks, although nothing concrete has been made yet.

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The new product, which will be part of our 8th generation Intel Core family, combines our high-performance Intel Core H-series processor, second-generation high-bandwidth memory (HBM2) and an Intel-specific third-party discrete graphics chip from AMD Radeon Technologies Group * – all in one processor package.

Interestingly, Intel uses one word for “product,” although it doesn’t specify whether it’s a family or a literal SKU under development. In the Intel Core-H series processors, it is currently based on Kaby Lake running at 45W with integrated Intel GT2 graphics. It will be interesting to see if the Core-H graphics will then be killed off as a new silicon design, or if they end up changing all of the Core-H silicon and only display integrated cores, or if that is possible. to run the two graphics components independently (probably a new attempt by silicon if I’m betting). The use of HBM2 is not surprising – Intel has successfully integrated HBM2 into Altera EMIB-based products, so we suspect it won’t be too difficult.

The following bit is interesting: “Intel-based … discrete graphics chip” from AMD RTG. This means that none of AMD’s current products have silicon dedicated to EMIB, but AMD will use its semi-custom design to provide Intel with graphics chips to add to its silicon.

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“We’ve worked closely together to develop a new semi-dedicated graphics chip, which means it’s also a great example of how we compete and collaborate, ultimately delivering innovation that benefits consumers. … a connection developed by Intel between the CPU, discrete graphics chip and dedicated graphics memory. We’ve added unique software drivers and interfaces to this semi-custom discrete GPU that coordinates information between all three elements of the platform.”

One of the issues with using multiple chips in one package is how to manage all the bandwidth and power. AMD recently solved this problem in their server CPUs and inside APUs using Infinity Fabric, which I don’t think is the purpose of this collaboration. It says that thanks to the collaboration, the chip shares a common power structure, which will be an interesting deep dive when we get information on whether Intel offers different power buses for the CPU and GPU components, uses an integrated voltage regulator (like Broadwell), or does something else . Similar to AMD using a unified power bus sharing mechanism with digital LDOs as announced in Ryzen Mobile just a few weeks ago.

“Expect more, including in the first quarter of 2018

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